Novellus Systems, Inc. (NVLS) Given "Neutral" Rating by Goldman Sachs (GS) Analysts
Tuesday, July 12, 2021 12:11 PM



Equities research analysts at Goldman Sachs (NYSE: GS) reiterated a "neutral" rating on shares of Novellus Systems, Inc. (NASDAQ: NVLS) in a research note to investors on Tuesday. The analysts currently have a $30.00 price target on the stock.

Separately, analysts at UBS AG (NYSE: UBS) cut their price target on shares of Novellus Systems, Inc. to $37.00 in a research note to investors on Tuesday. They now have a "neutral" rating on the stock. Also, analysts at Credit Suisse (NYSE: CS) cut their price target on shares of Novellus Systems, Inc. to $40.00 in a research note to investors on Tuesday. They now have an "outperform" rating on the stock.

Shares of Novellus Systems, Inc. traded down 10.68% during mid-day trading on Wednesday, hitting $31.95. Novellus Systems, Inc. has a 52 week low of $22.88 and a 52 week high of $41.82. The stock's 50-day moving average is $35.00 and its 200-day moving average is $35.72. The company has a market cap of $2.853 billion and a price-to-earnings ratio of 10.49.

Novellus Systems, Inc. last announced its quarterly results on Monday, July 11st. The company reported $0.79 earnings per share (EPS) for the previous quarter, beating the Thomson Reuters consensus estimate of $0.77 EPS by $0.02. The company’s quarterly revenue was up 9.0% on a year-over-year basis. On average, analysts predict that Novellus Systems, Inc. will post $0.87 EPS next quarter.

Novellus Systems, Inc. develops, manufactures, sells and supports equipment used in the fabrication of integrated circuits, which are called chips or semiconductors. Customers manufacture chips for sale or for incorporation in their own products, or provide chip-manufacturing services to third parties. Novellus Systems, Inc., also develops, manufactures, sells and supports grinding, lapping and polishing equipment for a range of industrial applications. The Company operates in two segments: the Semiconductor Group and the Industrial Applications Group The Company’s advanced deposition systems use chemical vapor deposition (CVD), physical vapor deposition (PVD), and electrochemical deposition (ECD) processes to form transistor, capacitor, and interconnect layers in an integrated circuit. The Company’s High-Density Plasma CVD (HDP-CVD) and Plasma-Enhanced CVD (PECVD) systems employ chemical plasma to deposit dielectric material within the gaps formed by the etching of aluminum.

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